He received his Ph. His major scientific interests are in the kinetic processes of crystal growth, and his scientific contributions include constitutional supercooling, the surface roughening transition, defect formation in crystals, and studies of alloy crystallization.
Handbook of Semiconductor Interconnection Technology, Second Edition - 인터넷교보문고
He pioneered in computer simulation studies of the atomic scale processes during crystal growth. He has received awards for his scientific contributions from both the American and the International Crystal Growth societies, and from the Materials Society of AIME, and has written and edited several books. He was elected to the National Academy of Engineering in Oonohoe Terry Turner Kenneth A.
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Parsey Jr. If you do not receive an email within 10 minutes, your email address may not be registered, and you may need to create a new Wiley Online Library account. If the address matches an existing account you will receive an email with instructions to retrieve your username. Bibliography Includes bibliographical references and index.
Semiconductor Materials and Process Technology Handbook
Summary Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the "Handbook of Semiconductor Manufacturing Technology, Second Edition" features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field.
Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.
This title helps readers to stay current with the latest technologies. In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on: silicon-on-insulator SOI materials and devices; supercritical CO2 in semiconductor cleaning; low-kappa dielectrics; atomic-layer deposition; damascene copper electroplating; and, effects of terrestrial radiation on integrated circuits ICs.
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Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the "Handbook of Semiconductor Manufacturing Technology" keeps the most important data, methods, tools, and techniques close at hand. Bibliographic information.
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Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
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